M. Wang et C. Laird, CHARACTERIZATION OF MICROSTRUCTURE AND TENSILE BEHAVIOR OF A CROSS-WOVEN C-SIC COMPOSITE, Acta materialia, 44(4), 1996, pp. 1371-1387
Citations number
23
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
The microstructure of a cross-woven C-SiC composite and its effect on
tensile behavior was studied in terms of damage and damage development
. Microstructure characterization revealed that the composite containe
d processing-induced cracks and nonuniform fiber bundle sections with
different fiber-matrix distributions. The processing-induced cracks an
d the ''soft'' matrix-discontinuous bundle sections were found to be t
wo of the main reasons for the low composite modulus. A largely nonlin
ear tensile stress-strain behavior was observed together with a contin
ued decrease of the modulus in the composite. This nonlinear tensile b
ehavior was caused by the propagation of the processing-induced cracks
, which led to low proportional limit, the multiplication of matrix cr
acks, and other damage modes such as fiber breaking, ply delamination
and bundle splitting. The tensile fracture of the composite was found
to occur at the ''weak link''-bundle crossover sections, which showed
very ragged fracture surfaces with limited fiber pull out.