Plasma immersion ion implantation (PIII) is an emerging technology pro
mising high dose-rate implantation and large-area processing compatibi
lity. Innovations of this technique include: area-independent implanta
tion time, concomitant deposition and implantation, and simple machine
design and maintenance. This review summarizes the current understand
ing of PIII plasma dynamics, dosimetry, and electronic materials appli
cations such as plasma doping for ultra-shallow junctions and high asp
ect ratio Si trenches, and subsurface synthesis of silicon-on-insulato
r materials.