CMOS FOUNDRY-BASED MICROMACHINING

This paper reports on the first results of a study of the possibilitie s of the fabrication of micromechanical structures for microsystems ap plications in a regular MPC run of a standard CMOS process, followed b y post-processing. Two post-processing modules, i.e., the frontside bu lk etching module and the surface micromachining module are investigat ed. Examples of the former are suspended spiral coils for high-frequen cy applications and of the latter, metal bridge resonators.