This paper reports on the first results of a study of the possibilitie
s of the fabrication of micromechanical structures for microsystems ap
plications in a regular MPC run of a standard CMOS process, followed b
y post-processing. Two post-processing modules, i.e., the frontside bu
lk etching module and the surface micromachining module are investigat
ed. Examples of the former are suspended spiral coils for high-frequen
cy applications and of the latter, metal bridge resonators.