EFFECT OF HYDROGEN PLASMA PRECLEANING ON THE REMOVAL OF INTERFACIAL AMORPHOUS LAYER IN THE CHEMICAL-VAPOR-DEPOSITION OF MICROCRYSTALLINE SILICON FILMS ON SILICON-OXIDE SURFACE

Authors
Citation
Yb. Park et Sw. Rhee, EFFECT OF HYDROGEN PLASMA PRECLEANING ON THE REMOVAL OF INTERFACIAL AMORPHOUS LAYER IN THE CHEMICAL-VAPOR-DEPOSITION OF MICROCRYSTALLINE SILICON FILMS ON SILICON-OXIDE SURFACE, Applied physics letters, 68(16), 1996, pp. 2219-2221
Citations number
16
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
68
Issue
16
Year of publication
1996
Pages
2219 - 2221
Database
ISI
SICI code
0003-6951(1996)68:16<2219:EOHPPO>2.0.ZU;2-N
Abstract
Microcrystalline silicon(mu c-Si) film deposited on silicon oxide in a remote plasma enhanced chemical vapor deposition (RPECVD) with disila ne (Si2H6) and silicon tetrafluoride (SIF4) has been investigated. It was found that in situ hydrogen plasma cleaning of the substrate prior to deposition is effective to reduce the interfacial amorphous transi tion region. It is believed that hydrogen plasma cleaning generated ad sorption and nucleation sites by breaking weak Si-O and Si-Si bonds an d also removed oxygen/carbon impurity. Surface roughening was observed from the hydrogen plasma precleaning which helped nucleation and crys tallization at the initial stage of the growth. (C) 1996 American Inst itute of Physics.