D. Emerson et al., PLASTIC-ENCAPSULATED MICROCIRCUIT RELIABILITY AND COST-EFFECTIVENESS STUDY, IEEE transactions on reliability, 45(1), 1996, pp. 19-22
This study evaluates the reliability and cost-effectiveness of using c
ommercial plastic-encapsulated microcircuits (PEM) in a typical milita
ry system, with a view to increasing their acceptability in military a
pplications. The cost comparison indicates an average 6-fold decrease
in cost when commercial devices are used. Assurance testing did not re
veal any special problems with commercial parts. Thus, if commercial P
EM were proven to be sufficiently reliable for an intended military ap
plication, large cost savings would be gained by using them instead of
hermetic packages. The 4.5-sigma enhanced inspection program and the
process-control methods suggested here would enhance the manufacturing
yield of the PLGR (precision lightweight global positioning system re
ceiver) by encouraging improvements in the manufacturing process while
simultaneously cutting the cost of a 100% rescreen to qualify the fin
al product. Neither the requirements assurance tests (including the st
ep-stress test-analyze-and-fix test), nor the reliability demonstratio
n test, nor the operational test, showed more failures than are typica
l for any new development, and no problems unique to PEM were observed
. Thus, the use of PEM did not lead to any special problems that cause
d PLGR-use specifications to be violated. Complete failure analysis of
the isolated parts is in progress, and the results will help to under
stand the specific reliability issues involved with the use of PEM in
military systems. These issues can then be addressed to improve the ac
ceptability of such devices in future military applications.