I. Dewolf, MICRO-RAMAN SPECTROSCOPY TO STUDY LOCAL MECHANICAL-STRESS IN SILICON INTEGRATED-CIRCUITS, Semiconductor science and technology, 11(2), 1996, pp. 139-154
Local mechanical stress is currently an important topic of concern in
microelectronics processing. A technique that has become increasingly
popular for local mechanical stress measurements is micro-Raman spectr
oscopy. In this paper, the theoretical background of Raman spectroscop
y, with special attention to its sensitivity for mechanical stress, is
discussed, and practical information is given for the application of
this technique to stress measurements in silicon integrated circuits.
An overview is given of some important applications of the technique,
illustrated with examples from the literature: the first studies of th
e influence of external stress on the Si Raman modes are reviewed; the
application of this technique to measure stress in silicon-on-insulat
or films is discussed; results of measurements of local stress in isol
ation structures and trenches are reviewed; and the use of micro-Raman
spectroscopy to obtain more information on stress in metals, by measu
ring the stress in the surrounding Si substrate is explained.