A previously proposed stress corrosion cracking (SCC) mechanism incorp
orating localized surface plasticity (LSP), crack initiation, and crac
k-tip embrittlement by anodic dissolution at film rupture sites is rev
iewed, together with new information supporting the mechanism External
ly imposed anodic dissolution currents increase creep rates of pure me
tals and alloys. Creep prior to SCC has been observed frequently and m
ay result from anodic currents at active film rupture sites caused by
coupling to surrounding noble passive surfaces. Recently revealed corr
elations between creep rate and SCC failure times imply that mechanism
s of creep and cracking may be related. Anodic attenuation of strain h
ardening at film rupture sites may cause LSP, leading to triaxial stre
ss conditions, suppressed slip, and crack initiation. Recent thin-film
diffusion experiments show evidence of vacancy formation at anodicall
y dissolving Cu surfaces. It has been suggested that anodically genera
ted vacancies may increase creep and plasticity by stimulation of disl
ocation climb or by attraction to dislocation cores. Point-defect vaca
ncies may weaken the crystal lattice, as do point-defect H atoms in th
e decohesion mechanism popular for explaining hydrogen embrittlement (
HE).