THE MECHANICAL-BEHAVIOR OF INTERCONNECT MATERIALS FOR ELECTRONIC PACKAGING

A variety of new materials are needed for solder interconnects in elec tronic packages for high- and low-temperature applications. This artic le compares the mechanical behavior of low-temperature materials (Sn-4 0In-20Pb, Sn-58Bi, and a silver-loaded conductive adhesive) and high-m elting-temperature solders (Sn-3.5Ag, Sn-3.4Ag-4.8Bi, and Sn-4.7Ag-1.7 Cu) to near-eutectic Sn-40Pb solder. The results indicate that there are promising materials alternatives to the traditional Sn-Pb solders in electronic interconnect applications.