Imr. Lee et Cg. Takoudis, PROCESS-PROPERTY RELATIONSHIPS IN SI1-XGEX CHEMICAL-VAPOR-DEPOSITION - THERMODYNAMIC AND KINETIC-STUDIES, Journal of the Electrochemical Society, 143(5), 1996, pp. 1719-1726
Thermodynamic and kinetic analyses of the Si1-xGex chemical vapor depo
sition were conducted to study the factors that contribute to the comp
osition of grown thin films as well as their growth rate. The thermody
namic analysis of the Si/Ge/H/Cl system showed that the addition of ch
lorine to the system directly affects the solid phase Ge content. Chlo
rine appears to be very effective in retaining silicon in the gas phas
e by forming a variety of chemical species at all temperatures studied
(400 to 800 degrees C), while it retains germanium by forming primari
ly GeCl2 in the gas phase only at higher temperatures. The effect of c
hlorine suggests that the composition of the Si1-xGex epitaxial layer
can be tuned to a desired value with the addition of a predetermined a
mount of chlorine to the system as an alternative to changing the rati
o of silicon and germanium gaseous sources. In the absence of chlorine
, the Si/Ge/H system appears to be more kinetically controlled. A kine
tic study was done on the Si/Ge/H system to explain the experimentally
observed growth behaviors: a monotonic increase, a monotonic decrease
, and a maximum in growth rate with respect to solid phase Ge concentr
ation at low, high, and intermediate temperatures, respectively. A ger
mane-assisted hydrogen desorption path, coupled with the two parallel
growth paths from SiH4 and GeH4, where both species compete for the sa
me vacant surface sites, are shown to explain the three distinctive gr
owth rate behaviors observed.