Spontaneous delamination of thin stainless steel films on Si{100} wafe
rs is reported. The films were deposited using an ion beam technique a
nd were 0.5 mu m thick with a residual compressive stress of 2.2 GPa.
Analysis of blisters in spontaneously delaminated films using simple m
odels gives a satisfactory estimate of the residual stress. The possib
ility of utilizing the buckling patterns to determine the residual str
ess state in stainless steel films on Si substrates is then evaluated.