MODELING AND ANALYSIS OF SUBSTRATE COUPLING IN INTEGRATED-CIRCUITS

This paper describes a fast and accurate simulator for characterizing the effects of substrate coupling on integrated-circuit performance. T he technique uses the electrostatic Green function of the substrate me dium and the fast Fourier transform algorithm, It is demonstrated that this technique is suitable for optimization of layout for minimizatio n of substrate coupling, Analysis of substrate coupling in different t ypes of substrates and the utility of guard rings in different types o f substrates is also discussed. Experimental verification of the model s is presented.