MILLIMETER-WAVE MONOLITHIC INTEGRATED-CIRCUIT INTERCONNECTS USING ELECTROMAGNETIC-FIELD COUPLING

Standard interconnect and packaging techniques for millimeter-wave mon olithic integrated circuits (MIMIC's) tend to get more and more diffic ult at millimeter-wave frequencies due to the increased influence of d iscontinuities and tolerances, especially in conjunction with temperat ure and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. On this basis, co upling structures for feed-throughs out of a package as well as chip i nterconnects have been designed, fabricated, and tested in a scaled fr equency range and in the original millimeter-wave frequency range show ing good results with acceptable tolerance requirements.