AN EXPERIMENTAL-TECHNIQUE FOR FULL PACKAGE INDUCTANCE MATRIX CHARACTERIZATION

Authors
TSAI CT YIP WY
Citation
Ct. Tsai et Wy. Yip, AN EXPERIMENTAL-TECHNIQUE FOR FULL PACKAGE INDUCTANCE MATRIX CHARACTERIZATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(2), 1996, pp. 338-343
Citations number
16
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
19
Issue
2
Year of publication
1996
Pages
338 - 343
Database
ISI
SICI code
1070-9894(1996)19:2<338:AEFFPI>2.0.ZU;2-7
Abstract
A new experimental technique based an network analyzer was developed f or characterizing the full inductance matrices (both self and mutual i nductance) of package/interconnect structures, This frequency-domain b ased measurement technique, including its formulation and procedure, i s discussed in this paper, A total of four packages, an 120QFP, a 400T AB, a 313PBGA, and an Alloy 32 132CQFP were selected for the self/mutu al L characterization. The measurement results are compared to those o btained by using a time domain reflectometer (TDR)-based technique as well as with the modeling data calculated by 3-D EM tool.