With increasing frequency and power integration in many Power Electron
ics applications, interconnection modeling becomes of great importance
. The aim of this paper is to present how to take into account an impe
dance step in an interconnection track (solder pad for instance) using
PEEC method (Partial Element Equivalent Circuit [1]). The better way
to decompose the discontinuity is studied, according to the frequency
of interest. Results are compared to measurements, carried on a printe
d circuit board (PCB) loop and to analytical resolution at low frequen
cy.