Vertical p-MOS transistors with channel lengths of similar to 130nm ha
ve been fabricated using selective LPCVD epitaxy for the definition of
the channel region, instead of fine line lithography. Owing to self-a
ligned facet growth the channel region and the volume diode which limi
ted the parasitic bipolar transistor can be designed more independentl
y. Thus a short-channel p-MOS transistor with a high breakthrough volt
age, an ideal subthreshold behaviour and a high transconductance was f
abricated.