WETTABILITY OF CUNI-TI ALLOYS ON SI3N4 AND INTERFACIAL REACTION-PRODUCTS

Citation
Cg. Wan et al., WETTABILITY OF CUNI-TI ALLOYS ON SI3N4 AND INTERFACIAL REACTION-PRODUCTS, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 12(3), 1996, pp. 219-222
Citations number
8
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
ISSN journal
10050302
Volume
12
Issue
3
Year of publication
1996
Pages
219 - 222
Database
ISI
SICI code
1005-0302(1996)12:3<219:WOCAOS>2.0.ZU;2-9
Abstract
Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233 similar to 1573 K, the wetting angles of CuNi-0 similar to 56 at pct Ti alloys on Si3N4 have been measured by the sessile drop method. With the increase of Ti content, the wetting angles decreased. The equilibrium wetting angle was 5 degrees when Ti content greater than or equal to 32 at pct. In t he case of same Ti content, the activity of Ti in CuNiTi alloy was wea ker than that in CuTi alloy. The cross-section of the CuNiTi-Si3N4 int erface and the elements distribution were examined by scanning electro n microscope with X-ray wave-dispersion spectrometer, and the reaction products formed at the interface were determined by X-ray diffraction analysis method.