Cg. Wan et al., WETTABILITY OF CUNI-TI ALLOYS ON SI3N4 AND INTERFACIAL REACTION-PRODUCTS, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 12(3), 1996, pp. 219-222
Citations number
8
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to
Ni in constant and in the temperature range of 1233 similar to 1573 K,
the wetting angles of CuNi-0 similar to 56 at pct Ti alloys on Si3N4
have been measured by the sessile drop method. With the increase of Ti
content, the wetting angles decreased. The equilibrium wetting angle
was 5 degrees when Ti content greater than or equal to 32 at pct. In t
he case of same Ti content, the activity of Ti in CuNiTi alloy was wea
ker than that in CuTi alloy. The cross-section of the CuNiTi-Si3N4 int
erface and the elements distribution were examined by scanning electro
n microscope with X-ray wave-dispersion spectrometer, and the reaction
products formed at the interface were determined by X-ray diffraction
analysis method.