SURFACE MODIFICATION OF CHEMICALLY VAPOR-DEPOSITED DIAMOND FOR PRODUCING ADHERENT THICK AND THIN-FILM METALLIZATIONS FOR ELECTRONIC PACKAGING

Authors
Citation
Esk. Menon et I. Dutta, SURFACE MODIFICATION OF CHEMICALLY VAPOR-DEPOSITED DIAMOND FOR PRODUCING ADHERENT THICK AND THIN-FILM METALLIZATIONS FOR ELECTRONIC PACKAGING, Applied physics letters, 68(21), 1996, pp. 2951-2952
Citations number
5
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
68
Issue
21
Year of publication
1996
Pages
2951 - 2952
Database
ISI
SICI code
0003-6951(1996)68:21<2951:SMOCVD>2.0.ZU;2-3
Abstract
In order to make chemically vapor deposited diamond (CVDD) substrates amenable to surface metallization without significant reduction in the rmal conductivity, very thin alumina films were grown on diamond by va por deposition of Al in oxygen atmosphere, followed by very low-temper ature annealing in oxygen. A Cr interlayer initially deposited on CVDD prior to alumina deposition was found to lead to excellent adhesion b etween the substrate and the deposit. The alumina films were character ized by scanning and transmission electron microscopy as well as Auger electron spectroscopy. (C) 1996 American Institute of Physics.