Esk. Menon et I. Dutta, SURFACE MODIFICATION OF CHEMICALLY VAPOR-DEPOSITED DIAMOND FOR PRODUCING ADHERENT THICK AND THIN-FILM METALLIZATIONS FOR ELECTRONIC PACKAGING, Applied physics letters, 68(21), 1996, pp. 2951-2952
In order to make chemically vapor deposited diamond (CVDD) substrates
amenable to surface metallization without significant reduction in the
rmal conductivity, very thin alumina films were grown on diamond by va
por deposition of Al in oxygen atmosphere, followed by very low-temper
ature annealing in oxygen. A Cr interlayer initially deposited on CVDD
prior to alumina deposition was found to lead to excellent adhesion b
etween the substrate and the deposit. The alumina films were character
ized by scanning and transmission electron microscopy as well as Auger
electron spectroscopy. (C) 1996 American Institute of Physics.