STABILITY OF THIN-LAYER ELECTRODEPOSITED COPPER IN SOLID POLYMER ELECTROLYTE

In the course of our studies on variable reflection windows involving copper deposition, we have proposed to use P(EO)nKCuxI1+x complexes. T he excess I- ions stabilizes copper (I) through formation of [CuIn+1]n - and the transport of copper is solely due to the diffusion of anioni c complexes which acts as copper vehicles. Copper electrodeposition ha s been observed. The stripping of the copper layers strongly depends u pon the relaxation time between the copper plating and the beginning o f the anodic voltametric scan. The copper deposit slowly vanishes with time. A cathodic current is observed before the copper plating proces s which we relate to the possible reduction of an oxidizing species pr esent in the electrolyte. The search for such oxidizing species (Cu2+, I3-) has been made using ESR and Raman spectroscopy and we have shown the presence of I3-).