Ijr. Baumvol et al., THERMAL NITRIDATION OF SIO2-FILMS IN AMMONIA - THE ROLE OF HYDROGEN, Journal of the Electrochemical Society, 143(4), 1996, pp. 1426-1434
We investigated the transport of hydrogenous species during thermal ni
tridation of silicon dioxide films in ammonia by means of isotopic tra
cing of hydrogen. The dependence of the amount of hydrogen incorporate
d in the oxynitride films on the nitriding temperature and time, ammon
ia pressure, and on the initial oxide thickness was determined using m
ethods that allow discrimination between the incorporation of hydrogen
in the oxynitride films during nitridation and the effect of hydrogen
adsorption during exposure of the oxynitride films to air. The depth
profiles of hydrogen and the number of hydrogen atoms that are exchang
ed between the oxynitride films and the ammonia gas are also establish
ed The results indicate that the nitridation is driven by a mechanism
whereby ammonia diffuses toward the oxide/Si interface reacting with t
he silica network. The nitridation of the surface and of the interface
creates diffusion barriers whose effect on the nitridation process, a
s well as on the incorporation of hydrogen in the oxynitride films, is
discussed.