Ga. Slack et al., GASEOUS OXYGEN AT HIGH-PRESSURE AND ITS INTERACTION WITH CUPRIC OXIDE, Physical review. B, Condensed matter, 47(18), 1993, pp. 12018-12029
Powder samples of CuO have been heat treated in gaseous O2 at temperat
ures from 673 to 973 K an gas pressures up to 3000 atm using high-temp
erature, metal pressure cells. Samples have also been run in a higher-
pressure ''belt'' apparatus using KClO3 as the source of oxygen. The C
uO incorporates excess oxygen up to about 2% but no higher oxides such
as Cu3O4 or Cu2O3 or CuO2 were found. The excess oxygen in CuO may be
present as peroxide ions. These produce only small effects on the ele
ctrical properties of CuO. Some experiments of a similar nature were m
ade on Cu2Y2O5 which accommodates more excess oxygen. These results ar
e discussed as a function of both oxygen pressure and oxygen fugacity.
Since no previous correlations of oxygen pressure and fugacity were a
vailable, this study presents such plots. A pressure-temperature-densi
ty plot for solid and fluid oxgyen is given up to 170 000 atm, 1300 K,
and 2.6 g/cm-3 from which oxygen fugacities have been calculated. Com
parisons of the present results with previous work on NiO, ZnO, and La
2CuO, are also given.