Rapid thermal processing is used for post-metallization annealing (PMA
) in this work. It was found that the rapid thermal PMA can do almost
the same anneal work in the initial characteristics of MOS capacitors
with an oxide thickness of 10 nm as the conventional furnace PMP;. But
the reliabilities in hot-carrier and radiation resistances of MOS cap
acitors depend on the PMA process significantly. It was found that rap
id thermal PMA samples exhibit worse properties in hot-carrier resista
nce but better properties in radiation hardness than furnace PMA sampl
es. For rapid thermal PMA process, the higher the annealing temperatur
e, the stronger the initial annealing extent but the worse the hot-car
rier and the radiation resistances.