ELLIPSOMETRIC STUDY OF THERMAL AND LASER ANNEALED AMORPHOUS AND MICROCRYSTALLINE SILICON FILMS
Citation
Ah. Jayatissa et al., ELLIPSOMETRIC STUDY OF THERMAL AND LASER ANNEALED AMORPHOUS AND MICROCRYSTALLINE SILICON FILMS, Applied surface science, 92, 1996, pp. 300-305
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
SICI code
0169-4332(1996)92:<300:ESOTAL>2.0.ZU;2-3
Abstract
Spectroscopic ellipsometry measurements were used to characterize ther
mally and laser annealed mu c-Si and a-Si films deposited with the rf
glow discharge method. The films were modeled as multilayer structures
to estimate the dielectric functions, composition and thickness of ea
ch layer. It was found that the mu c-Si films recrystallize at an ener
gy density above 200 mJ/cm(2) of the KrF excimer laser, with a crystal
linity fraction above 70%. The thickness of the recrystallized layer i
ncreases with the energy density but the crystallinity fraction is alm
ost unchanged above the threshold energy density; Our results show tha
t the laser recrystallized layer of mu c-Si has a higher uniformity an
d crystalline fraction compared to laser annealed a-Si films. The film
composition of laser annealed samples also favorably compares with th
at of thermally annealed mu c-Si and a-Si films.