In this letter, we demonstrate a unique approach for low temperature e
pitaxial growth of single crystal silicon films on Si(100). Pulsed sup
ersonic jet epitaxy (PSJE), employs high kinetic energy jets of a disi
lane-hydrogen mixture incident on the surface leading to layer by laye
r growth. Precise control of film thickness and significantly higher s
ticking coefficients are demonstrated. Growth rate dependence of pulse
frequency and its implications are discussed. We have been able to re
producibly deposit good quality single crystalline films at temperatur
es as low as 400 degrees C with this technique, without the use of any
external activation. (C) 1995 American Institute of Physics.