Degradation of NMOS and enhancement of PMOS I-V characteristics are fo
und to be dependent on specific isolation processes in thin-film SOI d
evices, These variations are due to mobility decrease in NMOS and incr
ease In PMOS, which can be attributed to the isolation-process-related
compressive strain of the silicon film, Magnitudes of mobility variat
ion as high as 40% are observed in the affected SOI devices.