P. Guerrero et al., INFLUENCE OF CURE SCHEDULE AND STOICHIOMETRY ON THE DYNAMIC-MECHANICAL BEHAVIOR OF TETRAFUNCTIONAL EPOXY-RESINS CURED WITH ANHYDRIDES, Polymer, 37(11), 1996, pp. 2195-2200
Epoxy networks based on N,N,N',N'-tetraglycidyl-4,4'-diamino diphenylm
ethane (TGDDM) prepolymer were prepared with cis-1,2,3,6-tetrahydropht
halic anhydride (THPA) curing agent at anhydride/epoxy group ratios va
rying from 0.3 to 1.0. For post-cured mixtures, dynamic mechanical tes
ts show that the glass transition temperature reaches the maximum valu
e at stoichiometric ratios between 0.8 and 0.9. This behaviour has bee
n related to the crosslink density of the formed networks, and also to
etherification reactions occurring during cure which lower the amount
of anhydride needed in order to complete the curing process. The stud
y of cure cycle variations on the viscoelastic properties showed that
for epoxy/anhydride mixtures high post-cure temperatures could be need
ed to reduce the amount of unreacted epoxy groups after curing. Fourie
r transform infra-red spectroscopy has been used to analyse the residu
al epoxy groups and also to study the influence of the different cure
reactions on the physical properties of these networks. Copyright (C)
1996 Elsevier Science Ltd.