This paper describes a robust and reliable process for fabricating a n
ovel sputter-deposited, thin-film carbon microelectrode array using st
andard integrated circuit technologies and silicon micromachining. Spu
tter-deposited carbon films were investigated as potential candidates
for microelectrode materials. The surface properties and cross section
of the microelectrode arrays were studied by atomic force microscopy
and scanning electron microscopy, respectively. Electrical site impeda
nce, crosstalk, and lifetime (dielectric integrity) of microelectrodes
in the array were characterized. Electrochemical response of the micr
oelectrodes to hexaammineruthenium(III) chloride and dopamine were inv
estigated by fast-scan cyclic voltammetry and high-speed, computer-bas
ed chronoamperometry; results show that thin-film carbon microelectrod
es are well-behaved electrochemically. The thin carbon films offer ext
remely good electrical, mechanical, and chemical properties and thus q
ualify as viable candidates for various electroanalytical applications
, particularly acute neurophysiological studies.