ENERGETIC PARTICLES IN PVD TECHNOLOGY - PARTICLE-SURFACE INTERACTION PROCESSES AND ENERGY-PARTICLE RELATIONSHIPS IN THIN-FILM DEPOSITION

Energetic deposition techniques, including ion beam assisted depositio n, ion plating, unbalanced magnetron sputtering, and cathodic-arc depo sition, are playing an increasing role in the processing of coatings f or mechanical, optical, and electronic applications, and for the prote ction of surfaces in hostile environments. Advantages of energetic fil m deposition include low temperature processing, improved adhesion to substrates, production ol desired phases or compounds, and control of crystallographic orientation. There are certain fundamental physical p rocesses common to these energetic deposition methods that involve the alloying of elements (ion implantation, condensate and gas adsorption ), material removal (sputtering, desorption), collision-induced displa cements, collision-stimulated thermal exchange, and collision-induced surface and bulk diffusion. The mechanisms by which these mechanisms a ffect film formation are under intense investigation. New Monte Carlo and molecular dynamics simulations of the effects of energetic atoms o n surfaces as well as experimental investigations revealing relationsh ips between deposition variables and phase formation are contributing to our understanding of thin film growth. This paper covers the above topics by first establishing the 'ideal' conditions for deposition of a film, indicates how different deposition processes attempt to approx imate these conditions, and reviews known correlations between deposit ion variables and film characteristics.