NEW MULTICHIP-ON-SILICON PACKAGING SCHEME FOR MICROSYSTEMS

With the increasing complexity of integrated electronic circuit and se nsor chips, the need for efficient packaging schemes becomes acute. Id eally one wants a high degree of flexibility, the possibility of accom modating chips with different functionalities, a high packaging densit y, good mechanical and thermal properties, a large heat-removal capaci ty and compatibility with automated assembly. In this work we present a new multichip-on-silicon (MCSi) packaging scheme with these characte ristics. We show how it can be applied with the example of an optoelec tronic microsystem.