Multi-Chip Modules (MCM) are an area where process synthesis and sched
uling are essential to lowering their production cost. At the present
time, MCMs are too expensive except for; high-end applications such as
military or supercomputer hardware. The goal of this paper is to outl
ine the various processing and testing steps for MCM manufacturing usi
ng a State-Task Network (STN), and describe the formulation of the opt
imization and scheduling problems for a sub-process. The final portion
will describe an example of the use of the STN and optimization model
to produce an MILP formulation of both electroless and electroplating
copper deposition at fixed processing conditions.