A double resurf high voltage IC technology using a linearly varying do
ped (LVD) p(-) layer al the surface of a lateral power device is propo
sed. Detailed numerical simulations indicate enhancement in the perfor
mance of a lateral double diffused MOSFET (LDMOS) incorporating an LVD
p(-) layer in comparison to a uniform p(-) layer. Moreover, this tech
nique is found to very effective as an interconnection technology.