Vd. Stankovic et M. Gojo, ELECTRODEPOSITED COMPOSITE COATINGS OF COPPER WITH INERT, SEMICONDUCTIVE AND CONDUCTIVE PARTICLES, Surface & coatings technology, 81(2-3), 1996, pp. 225-232
Data for the codeposition of some types of inert, semiconductive and c
onductive particles with copper in the electroplating are presented. I
t is shown that current density and particle concentration in the plat
ing bath strongly affect the particle content in the composites produc
ed. The nature of the particles also has a great influence on the amou
nt of particles entrapped in composites. The presence of particles in
composites changes their characteristics, making them better or worse
with respect to tensile strength, hardness or surface texture. The par
ticle distribution in electrodeposited composites is uniform across an
d over the coating.