ELECTRODEPOSITED COMPOSITE COATINGS OF COPPER WITH INERT, SEMICONDUCTIVE AND CONDUCTIVE PARTICLES

Data for the codeposition of some types of inert, semiconductive and c onductive particles with copper in the electroplating are presented. I t is shown that current density and particle concentration in the plat ing bath strongly affect the particle content in the composites produc ed. The nature of the particles also has a great influence on the amou nt of particles entrapped in composites. The presence of particles in composites changes their characteristics, making them better or worse with respect to tensile strength, hardness or surface texture. The par ticle distribution in electrodeposited composites is uniform across an d over the coating.