THE MICROSTRUCTURE OF TI-B-N FILM-SUBSTRATE INTERFACES

Ti-B-N films were deposited on W18Cr4V high speed steels by using N io n bombardment on an electron beam ion plated Ti-B film. Scanning elect ron microscopy and transmission electron microscopy morphology of the samples shows that the films are found to have a dense and fine nanocr ystalline structure, and a dense close interface bonding exists betwee n the film and the substrate. Auger electron spectroscopy depth profil ing analysis of the film indicates that N and Ti penetrate into the su bstrate, resulting in a wide interfacial diffusion zone, which is abou t 150 nm. Microdiffraction patterns of the interface show that FeTi, F e2Ti, and Ti2N phases exist in the interfacial diffusion zone. The res ults obtained indicate that the method of bombarding the him by N ions extends the film-substrate interfacial diffusion zone and stimulates the interfacial chemical reaction.