T. Pochet et al., SENSITIVITY MEASUREMENTS OF THICK AMORPHOUS-SILICON P-I-N NUCLEAR-DETECTORS, IEEE transactions on nuclear science, 43(3), 1996, pp. 1452-1457
20 mu m thick p-i-n diodes were deposited at high rate using a PECVD p
rocess. The p-i-n structures have been specifically tailored in order
to sustain high reverse bias voltages and exhibit low leakage currents
. Mean electric fields up to 5.10(5) V/cm have been applied to our dev
ices. We report the electrical characterization of such devices in ter
ms of I(V,T) curves. Different regimes have been identified and the ac
tivation energy of the reverse current is deduced. A spectral analysis
of the noise has been performed. Electronic transport of both electro
ns and holes has been studied using a Time of Flight technique. Finall
y, the detector response to alpha and beta particles, and X-rays has b
een studied in order to measure the collection efficiencies of thick a
-Si:H detectors.