ON-DIE DIFFRACTIVE ALIGNMENT STRUCTURES FOR PACKAGING OF MICROLENS ARRAYS WITH 2-D OPTOELECTRONIC DEVICE ARRAYS

Authors
BOISSET GC ROBERTSON B HSIAO WS TAGHIZADEH MR SIMMONS J SONG K MATIN M THOMPSON DA PLANT DV
Citation
Gc. Boisset et al., ON-DIE DIFFRACTIVE ALIGNMENT STRUCTURES FOR PACKAGING OF MICROLENS ARRAYS WITH 2-D OPTOELECTRONIC DEVICE ARRAYS, IEEE photonics technology letters, 8(7), 1996, pp. 918-920
Citations number
10
Categorie Soggetti
Optics,"Physics, Applied
Journal title
IEEE photonics technology letters → ACNP
ISSN journal
10411135
Volume
8
Issue
7
Year of publication
1996
Pages
918 - 920
Database
ISI
SICI code
1041-1135(1996)8:7<918:ODASFP>2.0.ZU;2-Z
Abstract
A novel technique for aligning a microlens array to an electrically pa ckaged optoelectronic device array is presented: reflective Fresnel zo ne plates (FZP's) are fabricated on the device die to pro,ide registra tion spots during alignment. A proof-of-concept experiment in which an MSM array was aligned to a microlens array with an accuracy of better than 9 microns is described.