LENS-COUPLED LASER-DIODE MODULE INTEGRATED ON SILICON PLATFORM

Recent interests in the development of multiservice systems have incre ased the activities be reduced. However, current commercial-grade manu facturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fi ber to the home (FTTH). For these systems to be viable, the optical mo dule assemble costs and package size must process of finding the optim um optical coupling position, In addition, the number and size of part s cannot be reduced due to the difficulty of manipulating them, As a n ew approach for a lower cost, compact packaging solution, silicon plat form technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-dio de, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.