The oxidation of Co film on Si and SiO2 substrates during heat treatme
nt was investigated by TEM, HREM and XRD. The results show that the co
balt oxide on Si and SiO2 substrates, annealed below 550 degrees C, is
found to be CoO instead of Co3O4. Analysis showed that the annealing
ambient affected the results. Oxidation of Co films also has an effect
on the silicide formation at the Co/Si interface, and it leads to CoS
i2 formation at a lower temperature than without oxidation. We also co
nfirmed that CoO formed before annealing at 550 degrees C can complete
ly change into silicide after further heating under vacuum at 900 degr
ees C for 5 min.