COMPARISON OF THERMAL-SHUNT AND FLIP-CHIP HBT THERMAL IMPEDANCES - COMMENT ON NOVEL HBT WITH REDUCED THERMAL IMPEDANCE

JENKINS T BOZADA C DETTMER R SEWELL J VIA D BARRETTE J EBEL J DESALVO G HAVASY C LIOU L QUACH T GILLESPIE J PETTIFORD C ITO C NAKANO K ANHOLT R

T. Jenkins et al., COMPARISON OF THERMAL-SHUNT AND FLIP-CHIP HBT THERMAL IMPEDANCES - COMMENT ON NOVEL HBT WITH REDUCED THERMAL IMPEDANCE, IEEE microwave and guided wave letters, 6(7), 1996, pp. 268-269

6

Engineering, Eletrical & Electronic

IEEE microwave and guided wave letters → ACNP

10518207

6

7

1996

268 - 269

ISI

1051-8207(1996)6:7<268:COTAFH>2.0.ZU;2-E