SHOCK AND VIBRATION OF SOLDER BUMPED FLIP-CHIP ON ORGANIC COATED COPPER BOARDS

Authors
LAU J SCHNEIDER E BAKER T
Citation
J. Lau et al., SHOCK AND VIBRATION OF SOLDER BUMPED FLIP-CHIP ON ORGANIC COATED COPPER BOARDS, Journal of electronic packaging, 118(2), 1996, pp. 101-104
Citations number
22
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
118
Issue
2
Year of publication
1996
Pages
101 - 104
Database
ISI
SICI code
1043-7398(1996)118:2<101:SAVOSB>2.0.ZU;2-D
Abstract
The reliability of solder bumped flip chips on organic coated copper ( OCC) printed circuit board (PCB) has been studied by shock and vibrati on tests and a mathematical analysis. Two different chip sizes (7 mm a nd 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. Howe ver, for the out-of-plane vibration tests all the chips were underfill ed with epoxy.