PREFERENTIAL VAPORIZATION AND PLASMA SHIELDING DURING NANO-SECOND LASER-ABLATION

Citation
Xl. Mao et al., PREFERENTIAL VAPORIZATION AND PLASMA SHIELDING DURING NANO-SECOND LASER-ABLATION, Applied surface science, 96-8, 1996, pp. 126-130
Citations number
21
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
Journal title
ISSN journal
01694332
Volume
96-8
Year of publication
1996
Pages
126 - 130
Database
ISI
SICI code
0169-4332(1996)96-8:<126:PVAPSD>2.0.ZU;2-7
Abstract
Preferential removal of components from mixed material targets and pla sma shielding are studied by using inductively coupled plasma-atomic e mission spectrometry (LCP-AES) during UV nano-second laser ablation. T he ICP emission intensity for Cu and Zn during ablation of brass sampl es varies versus laser power density. A model using thermal evaporatio n and inverse Bremsstrahlung processes is presented. The model shows t hat plasma shielding occurs at approximately 0.3 GW/cm(2), in agreemen t with experimental data for change in the mass ablation rate. The goo d agreement of model and experimental data suggest that thermal effect s are important during nano-second laser ablation for power density le ss than 0.3 GW/cm(2).