SILICON MICROMACHINING FOR INTEGRATED MICROSYSTEMS

Small sized but relatively complicated intelligent systems or subsyste ms were fabricated based on silicon micromachining. Packaged micromech anical sensors as extremely sensitive resonant sensors, accelerometers and a silicon diaphragm capacitive vacuum sensor were developed. A tw o-dimensional electromagnetic optical scanner was also developed. The Vacuum pressures in the packaged cavities of these devices were well c ontrolled. Microflow control systems which have bakable microvalves we re fabricated for advanced semiconductor processes. Novel three-dimens ional microfabrication methods were developed for silicon micromachini ng. Copyright (C) 1996 Elsevier Science Ltd.