LOW-COST TECHNOLOGY FOR MULTILAYER ELECTROPLATED PARTS USING LAMINATED DRY FILM RESIST

Citation
H. Lorenz et al., LOW-COST TECHNOLOGY FOR MULTILAYER ELECTROPLATED PARTS USING LAMINATED DRY FILM RESIST, Sensors and actuators. A, Physical, 53(1-3), 1996, pp. 364-368
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation
ISSN journal
09244247
Volume
53
Issue
1-3
Year of publication
1996
Pages
364 - 368
Database
ISI
SICI code
0924-4247(1996)53:1-3<364:LTFMEP>2.0.ZU;2-L
Abstract
An innovative technology for the realization of key elements of a micr ofabricated reduction unit is presented. In view of integrating the fu nctions of gear, pinion and axle into one element, multilevel metal el ectroplating in a negative dry film resist mould (Riston) is used. Eas ier processing, inherent planarization for multilevel 3-D structures, vertical sidewalls and high thicknesses (20-50 mu m/level) are shown t o be the main key features of dry films. To demonstrate the process fe asibility, a gear and pinion set with upper and lower axle posts has b een realized with four levels of nickel.