Interface formation of copper on both reduced and stoichiometric SrTiO
3(100) was investigated using photoemission (XPS, UPS), electron diffr
action (LEED) and electron energy loss spectroscopy (HREELS). The grow
th mode of Cu on both surfaces involves the formation of a 2D-like lay
er and islands, but the thickness of the 2D-like layer and the number
of islands is higher on the reduced substrate due to the higher number
of defects. An analysis of the Auger parameter of Cu during growth de
monstrates the strong interaction of Cu with SrTiO3. HREELS experiment
s showed a strong influence of the impact scattering interaction from
the changes in the spectra with coverage, and the importance of the tw
o different terminations of the (100) surface.