There is an increased demand of the explanation of the thin film fabri
cation mechanism, especially for thickness uniformity, film quality an
d product yield. Any modeling of the mechanism requires a sufficient k
nowledge of the basic mechanism of interaction and reaction of the par
ticles with the substrate, As a first step, here, the model of silicon
thin film formation under low-pressure CVD is considered, Silicon fil
m formation and growth on a clean solid substrate is simulated applyin
g the molecular dynamics and chemical reaction principles. The analyze
d domain is enclosed in a hexagonal box which has periodic boundary co
nditions and a different flow energy of the particle, The atom surface
adsorption and inelastic collision are discussed considering the exch
ange energy between the particles and the surface, In order to provide
a well visualized description, a graphics program is made to show the
particle movement and the film fabricating process in three dimension
s. The present simulation is advantageous to the macro-understanding o
f the thin film formation mechanism and to fabricating the machine des
ign with optimum control.