TOXICOLOGICAL HAZARDS OF PLASMA-ETCHING WASTE PRODUCTS

Citation
S. Bauer et al., TOXICOLOGICAL HAZARDS OF PLASMA-ETCHING WASTE PRODUCTS, Solid state technology, 39(7), 1996, pp. 97
Citations number
27
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
0038111X
Volume
39
Issue
7
Year of publication
1996
Database
ISI
SICI code
0038-111X(1996)39:7<97:THOPWP>2.0.ZU;2-7
Abstract
Complex analytical and toxicological studies of the waste products fro m aluminum plasma etching were performed over a four-year period. Thos e studies formed part of a research project to determine health risks of plasma etching processes in the semiconductor industry. Many differ ent organic compounds were identified and quantified in the waste gase s, vacuum pump oils, and solid debris collected from air pipe systems. The identified compounds were exclusively poly- and perhalogenated hy drocarbons. Toxicological investigations showed clear genotoxic, embry otoxic, and teratogenic effects resulting from the waste products. Acc ordingly, we offer recommendations to ensure the safety of fab personn el.