THE ELECTROLYTIC PLATING OF COMPOSITIONALLY MODULATED ALLOYS AND LAMINATED METAL NANOSTRUCTURES BASED ON AN AUTOMATED COMPUTER-CONTROLLED DUAL-BATH SYSTEM

Citation
Dma. Nabirahni et al., THE ELECTROLYTIC PLATING OF COMPOSITIONALLY MODULATED ALLOYS AND LAMINATED METAL NANOSTRUCTURES BASED ON AN AUTOMATED COMPUTER-CONTROLLED DUAL-BATH SYSTEM, Nanotechnology, 7(2), 1996, pp. 134-143
Citations number
26
Categorie Soggetti
Engineering,"Physics, Applied
Journal title
ISSN journal
09574484
Volume
7
Issue
2
Year of publication
1996
Pages
134 - 143
Database
ISI
SICI code
0957-4484(1996)7:2<134:TEPOCM>2.0.ZU;2-J
Abstract
Compositionally modulated alloys (CMAs) and laminated nano-structures of metals are attracting ever-increasing enthusiasm due to their uniqu e mechanical, electrical and, in particular, magnetic properties when compared to those of the respective bulk metals, and as evidenced by n ew and fascinating applications reported in the literature. Until rece ntly, however, producing such multilayered coatings has been difficult at best, especially for larger samples of irregular configuration and in mass production. We will explain the design, objective and the use of our newly developed automated computer-controlled plating system f or producing large-scale CMA coatings and laminated nano-structures of metals. Electroplating bath constituent concentrations, pH, temperatu re, mode of agitation, etc, as well as galvanostatic modes, e.g. direc t current (d.c.) versus pulsed and/or pulse reversal currents, were op timized. Employing the automated dual-bath technique, multilayered com posite materials of copper-nickel and copper-cobalt with more than 100 0 alternating layers of varying dimensions, if desired, have been inve stigated and manufactured. The thickness of each sub-layer ranges from 25 nm to several micrometres (mu m). Effort was also expended in the generation of CMA structures from single electroplating baths where th e two metals of interest were present. The characterization results, a s elucidated with scanning electron microscopy (SEM), atomic absorptio n spectroscopy and x-ray fluorescence and diffraction methods, and app lications for such multilayered systems, in general, as well as the po ssibilities and limitation of the plating system are discussed.