We examine the formation of Si1-xCx (x = 0.04-0.2) by means of CFy (y
= 0, 1, 3) implantation in p-type Si, for application as a wide-bandga
p emitter in a Si heterojunction bipolar transistor. Upon implantation
with 2.5 x 10(16) CF+/cm(2) at 45 keV, and subsequently with 2.5 x 10
(16) C+/cm(2) at 30 keV, an amorphous top layer is formed. Annealing a
t temperatures up to 900 degrees C leads to a layer consisting of nano
crystalline material. High resolution transmission electron microscopy
and secondary ion mass spectrometry show that a well-defined nanocrys
talline/crystalline interface is created at an anneal temperature of 5
50 degrees C. At higher temperatures lattice defects start to develop.
Preliminary attempts to dope the material via phosphorus or arsenic i
mplantation indicate that temperatures of at least 900 degrees C are r
equired to activate a fraction of the implanted dopants. This, however
, adversely affects the adlayer/substrate interface.