DEVELOPMENT OF MECHANICAL SYSTEMS FOR MICRO-BONDING BY ADHESIVE - PROPOSAL OF MICRO-APPLICATION TECHNOLOGY OF ADHESIVE RESIN

Authors
HORIE M KOBAYASHI F IKEGAMI K OKABE S
Citation
M. Horie et al., DEVELOPMENT OF MECHANICAL SYSTEMS FOR MICRO-BONDING BY ADHESIVE - PROPOSAL OF MICRO-APPLICATION TECHNOLOGY OF ADHESIVE RESIN, JSME international journal. Series C, dynamics, control, robotics, design and manufacturing, 39(2), 1996, pp. 365-370
Citations number
1
Categorie Soggetti
Engineering, Mechanical
Journal title
JSME international journal. Series C, dynamics, control, robotics, design and manufacturing → ACNP
ISSN journal
13408062
Volume
39
Issue
2
Year of publication
1996
Pages
365 - 370
Database
ISI
SICI code
1340-8062(1996)39:2<365:DOMSFM>2.0.ZU;2-4
Abstract
This paper proposes a method of application of micro amounts of adhesi ve resin by using a needle. The process of micro-application of the re sin is experimentally investigated. The amount of adhesive resin on th e needle is influenced by the shape and size of the needle. The micro- application of adhesive resin is dependent on the handling process of the needle to transfer adhesive resin on the adherent surface. The des ign parameters of mechanical systems for micro-application of adhesive resin is discussed.