EFFECT OF ELECTROPHYSICAL ACTIVATION OF COMPONENTS ON ADHESIVE INTERACTION IN POLYMER COMPOSITES

The key problem in designing polymeric composites is ensuring a suffic iently strong adhesive bond between the polymer and the filler (or the reinforcement). One method for strengthening the intermolecular inter action at the phase interface is electrophysical activation of the par ticle surface. We have investigated the absorption activity and adhesi veness of powdered inorganic fillers and polymeric binders with triboe lectric activation and activation in a corona discharge. We consider a broad class of disperse materials. We show that electrophysical activ ation of powdered materials causes changes in the concentration of don or and acceptor centers on the particle surface and in the adsorption activity of the materials as a whole. The presented results can be use d for goal-directed selection of the most effective method of activati on for disperse materials; they also are evidence for the important ro le of adsorption forces in the adhesion phenomenon.