ANNEALING BEHAVIOR OF PALLADIUM-NICKEL ALLOY ELECTRODEPOSITS

The annealing behavior of palladium-nickel alloy deposits in the range of 85-15 to 70-30 percent Pd-Ni can be utilized to produce a ductile electrodeposit amenable to stamping and forming of electronic contacts , Differential scanning calorimetry, scanning electron microscopy, and transmission electron microscopy have been employed to explain the an nealing behavior and reconcile the anomalous observations with the cla ssical binary phase diagram information, The annealed deposit has the desired physical properties characteristic of the Pd-Ni alloy, especia lly hardness, ductility, and corrosion resistance, Practical applicati on of the annealing process has been demonstrated in the electroplatin g, annealing and stamping and forming of stripe-on-strip 725 alloy and 910P materials to make electronic contacts and connectors.