PROCESS-INDUCED EFFECTS IN THIN-FILM BONDING OF PEKEKK IN METAL-POLYMER JOINTS

In this work, poly ether ketone ether ketone ketone (PEKEKK) was used as a thermoplastic adhesive for joining metals. Titanium and cobalt ch romium alloys were joined to form tensile butt joints. These tensile s pecimens were used to evaluate bond performance. A controlled thermal processing cycle was used to modify and enhance the polymer crystallin ity during bonding. The resulting effects on bond performance were exa mined. The process window for a thermal bonding process was identified . Factorial experiments were conducted to determine the effects of mod ifications to adhesive and adherend material, and bonding pressure on bond performance. A titanium alloy and a cobalt chromium alloy were us ed as the adherends. Understanding changes in the thermoplastic adhesi ve joint with the variation of process parameters will allow for prope r application and processing of thermoplastic structural adhesives.